AMD has developed a smaller "Phoenix 2" die featuring a 6-core CPU and a 4 CU iGPU.

AMD has developed a smaller version of its 4 nm "Phoenix" mobile processor silicon. This chip is expected to be used in lower-end mobile SKUs in the Ryzen 3 and Ryzen 5 series, as well as in Socket AM5 for Ryzen 3 and lower-end versions of Ryzen 5 desktop processors. The "Phoenix 2" or "PHX2" die is built on the same 4 nm foundry process as the standard "Phoenix" silicon. It features a 6-core/12-thread CPU based on the "Zen 4" microarchitecture and a smaller iGPU with two WGPs or 4 CUs, equivalent to 256 stream processors. The iGPU uses the same RDNA3 graphics architecture as the regular "Phoenix" silicon. It is uncertain whether the Ryzen AI component will be included in the PHX2 die, but considering AMD's focus on consumer AI acceleration, it is possible that it will be retained.

The PHX2 die is expected to retain the I/O of the regular "Phoenix," including a dual-channel (4 sub-channel) DDR5 and LPDDR5 memory interface, as well as a 24-lane PCI-Express Gen 4 root complex. These changes result in a die that is approximately three-quarters the size of the regular "Phoenix," with an area of around 137 mm² compared to the regular "Phoenix's" 178 mm². The smaller die will help reduce costs and improve yields for AMD. Currently, there are two reported processor models based on this die, the Ryzen 5 7540U and Ryzen 3 7440U. Both are 15 W to 28 W class mobile processors designed for thin-and-light notebooks.